On 12th October, SYMETA will welcome Professor Y C Chan from the City University of Hong Kong to Loughborough University to see SYMETA's research progress first hand. This is Professor Chan's second visit to the project. Later this Autumn SYMETA will also host a visit from Zita Yip Yuk Ngang one of Professor's Chan PhD students.
Professor Chan obtained his PhD in 1983, MSc (Eng) in 1978 and BSc (Eng) in 1977 from Imperial College of Science and Technology, London, and is currently Chair Professor of Electronic Engineering and Director of the Centre for Electronic Packaging, Failure Analysis and Reliability Engineering (EPA Centre) at City University of Hong Kong. Previously, he had a distinguished career in industry. He was elected Fellow of the IET in 2002, and Fellow of the Institute of Electrical and Electronic Engineers in 2004. Prof Chan has authored over 270 journal publications, 128 International conference papers and 4 books. His work is heavily cited (Most Cited Researcher in 2016 : Subject – Electrical & Electronic Engineering according to Shanghai Ranking’s Global Ranking of Academic Subjects 2016 ), and Scopus citations: 6209 & h-index 42, Web of Science citations: 5176 & h-index 39, Google scholar citations: 7793 & index 47), with his invited review “Failure mechanisms of solder interconnect under current stressing in advanced electronic packages”, Prog. Mat Sci 55, 428-475 (2010) attracting particular interest. He has graduated 22 PhDs and 9 MPhils in Electronic Packaging and Reliability Engineering, and 2 EngDs, and many of his former students are successful entrepreneurs, senior industrial managers or full professors.
During his visit to Loughborough Prof Chan deliver a research seminar Research Progress of electromigration (EM) and thermomigration (TM) in solder interconnects. His visit is supported by the Royal Academy of Engineering Distinguished Visiting Fellowship Scheme.